UnitySC retweeted
We are proud to announce our collaboration with @UnitySemi - for further development to fuel #Industry 4.0 with smarter tools leti-cea.com/cea-tech/leti/e…
UnitySC retweeted
We'll be in good company this week at the #MEPTEC event @SEMIexpos HQ with @asegroup_global @AmkorTechnology @STATSChipPACLtd @XilinxInc @intel @Microsoft - meptec.org/2017Q4/
UnitySC retweeted
Great discussions on future packaging trends at IMAPS including FO-WLPs, Intel's new LGA (long live LGA), and Xilinx HBM + FPGA!
UnitySC retweeted
Today, MEMS&Sensors Summit @MEMSGroup, Volker Herbig talks about: From sampling to ramping: the long way towards high volume MEMS production
UnitySC retweeted
TechSearch International celebrates our 30th Anniversary! So many changes in our industry in the last 30 years!!!
UnitySC retweeted
Read the latest EE Web Exclusive! Overcoming thin-wafer inspection challenges for high-volume manufacturing
evaluationengineering.com/ov…
UnitySC retweeted
Dr. SW Yoon will be presenting “eWLB FOWLP: Good to Great” at the iNEMI Q3 Webinar on Aug 28 & 29. bit.ly/2ivkfbc
UnitySC retweeted
See you and the crew at Semicon West!! lnkd.in/gvTzrZm
UnitySC retweeted
Packaging for #autonomous vehicle electronics? Join us today for an engaging plenary session at #ECTC2017 ow.ly/6yhm30bgZNi
UnitySC retweeted

Semiconductor Engineering@SemiEngineering11 May 2017
United States
United StatesConnected via United States App StoreAccount-level information, not a live location or per-post device.
2.5D, Fan-Out Inspection Issues Grow semiengineering.com/2-5d-fan… …
#fanout #3DIC #metrology #Inspection #TSVs
UnitySC retweeted
ASE's Ou Li comments on the increasingly stringent world of device #inspection and describes what ASE is doing #SiP bit.ly/2r2xoZz – at Sunnyvale, CA
UnitySC retweeted
Heterogeneous Integration big topic at Build China's IC Ecosystem Forum #semiconchina #semiconductor
UnitySC retweeted
Join us at @IMAPSOfficial Device Packaging Conf for #fanoutwlp #eWLB #SiP #automotive info at booth 55 bit.ly/2mtUadZ
UnitySC retweeted
Join us at @IMAPSOfficial Device Packaging Conf for #fanoutwlp #eWLB #SiP #flipchip #automotive info at booth 55 bit.ly/2mtUadZ
UnitySC retweeted
Very nice #3DSummit conference summary & wrap by Francoise @3DInCites @SEMIEurope #Queenof3D #3DIC #SiP – at Grenoble, France

























