Across every distance, we remain connected under the same moon. 🌕 This Mid-Autumn Festival, we celebrate the connections that bring us closer — across families, communities, and the technologies shaping our future. 🥮🌕 May the full moon bring warmth, togetherness, and meaningful connections to you and your loved ones, wherever you are. Happy Mid-Autumn Festival from ASE! 千里共嬋娟，情意永相連 日月光祝您 中秋佳節愉快 #ASE #日月光 #MidAutumnFestival

𝗧𝗵𝗿𝗼𝘄𝗯𝗮𝗰𝗸 𝘁𝗼 𝗮𝗻 𝗶𝗻𝗰𝗿𝗲𝗱𝗶𝗯𝗹𝗲 𝘄𝗲𝗲𝗸 𝗮𝘁 𝗦𝗘𝗠𝗜𝗖𝗢𝗡 𝗧𝗮𝗶𝘄𝗮𝗻 𝟮𝟬𝟮𝟲! From inspiring conversations on AI, heterogeneous integration and 3DIC to our 𝗳𝘂𝘁𝘂𝗿𝗲-𝗿𝗲𝗮𝗱𝘆 𝗽𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝘀𝗼𝗹𝘂𝘁𝗶𝗼𝗻𝘀 showcased at the @aseglobal booth, it was an exciting week of ideas, innovation and connections. Most importantly, thank you to everyone who stopped by to meet us — from industry professionals and students to everyone curious about the future of semiconductors. We truly enjoyed the conversations, questions and energy you brought to our booth. A big thank you as well to our ASE team and everyone who helped make this experience possible. That’s a wrap for #SEMICONTaiwan2026. 𝗦𝗲𝗲 𝘆𝗼𝘂 𝗮𝗴𝗮𝗶𝗻 𝗔𝘂𝗴𝘂𝘀𝘁 𝟭𝟴–𝟮𝟬, 𝟮𝟬𝟮𝟳! 👋

According to ASE's Teck Lee, “Panel-level packaging is opening a new path to scale advanced packaging, with improved area utilization, higher throughput potential and greater manufacturing efficiency.” Teck will take a deeper dive into the technology and its potential next week at #SEMICONTaiwan. If you’re heading to wonderful #Taipei, don’t miss it! #PanelLevelPackaging #AdvancedPackaging #HeterogeneousIntegration #ASETechTalks #VIPack #310x310 #panel #AI #DataCenter #HPC #energyefficiency #semiconductors #geometry #physics #science @SEMIAmericas

Taipei is where it's at this week, as we share how #advancedpackaging technologies are enabling the transition from #electrons to #photons. As AI systems push the limits of power efficiency, I/O and memory bandwidth, silicon photonics is emerging as a critical part of the path forward. Realizing its potential at scale will depend on how effectively these technologies can be integrated and packaged. In this short video, we look at ASE’s approach to that challenge, and why the move from electrons to photons represents an important step toward enabling the next generation of #AI infrastructure. Thanks for the powerful perspective, Ingu Yin Chang. Tomorrow, ASE’s CP Hung will expand on this vision during his keynote at #OCPAPAC. We'll also feature a demo in the exhibitor zone - please drop by if you're around. We’re excited to be here in Taipei, @PatriciaMacLeod, Harrison Chang, Charles Lee, Nicole Tien, in the midst of such a dynamic community, presenting ASE, exchanging ideas, and helping shape what comes next. A big thank you to George Tchaparian, Cliff Grossner Ph.D., @dirkvanslyke, Michael Schill, Kate Hendle, and the many others who have brought this OCP community together. #OCPAPAC26 #advancedpackaging #VIPack #siliconphotonics #CPO #OpenCompute #AIInfrastructure #OpenHardware #DataCenters #AI #Networking #Photonics #Cooling #Chiplets #Taiwan

#SEMICONSEA 2026 wrapped up on a high note after an exciting 3 days in Kuala Lumpur, Malaysia!  🇲🇾 Last week, ASE was proud to connect with customers, partners, industry professionals, and future talents at our booth, where visitors experienced our latest innovations and interactive showcases firsthand. At the ASE booth, visitors explored: ✨ Advanced packaging technologies and solutions powering the future of #AI and high-performance computing 🏭 An immersive VR #SmartFactory experience showcasing ASE’s smart manufacturing capabilities 👥 Career opportunities and networking sessions with our onsite HR recruitment team 🎁 Fun engagement activities and lucky draws featuring our limited-edition ASE swag We were also honored to welcome Datuk Seri Johari Abdul Ghani, Minister of Ministry of Investment, Trade and Industry (MITI) and YB Tze Tzin Sim, Deputy Minister of #MITI during the VIP booth tour, where discussions centered around advanced packaging, AI, heterogeneous integration, and smart manufacturing. A huge thank you to everyone who stopped by our booth, participated in our activities, and connected with the ASE team throughout the week. We truly appreciate the support and look forward to seeing you again at the next #SEMICONSEA! 👋

Join us at #𝗦𝗘𝗠𝗜𝗖𝗢𝗡 𝗦𝗘𝗔 𝟮𝟬𝟮𝟲 in Kuala Lumpur 🇲🇾 next week as we spotlight our thought leadership in 𝗮𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗽𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝗮𝗻𝗱 𝗰𝗼-𝗽𝗮𝗰𝗸𝗮𝗴𝗲𝗱 𝗼𝗽𝘁𝗶𝗰𝘀 (𝗖𝗣𝗢). We’re proud to have Jihan Chen, 𝘊𝘰𝘳𝘱𝘰𝘳𝘢𝘵𝘦 𝘙&𝘋 𝘋𝘪𝘳𝘦𝘤𝘵𝘰𝘳 at ASE Global, taking the stage to share insights on the future of high-performance computing and optical integration. 📢 Don’t miss our session: 🔹 𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 & 𝗛𝗲𝘁𝗲𝗿𝗼𝗴𝗲𝗻𝗲𝗼𝘂𝘀 𝗜𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗶𝗼𝗻 𝗦𝘂𝗺𝗺𝗶𝘁 𝟮 📅 05 May 2026 🕙 13:30 – 13:50 📍 Novel 2 | Level 1A, MITEC See you there! 👋 #SEMICONSEA2026 #ASE #CPO #Advancedpacking

Join ASE Global at #𝗦𝗘𝗠𝗜𝗖𝗢𝗡𝗦𝗘𝗔 𝟮𝟬𝟮𝟲 in Kuala Lumpur, Malaysia! 🇲🇾 From 05 to 07 May, visit us at 𝗕𝗼𝗼𝘁𝗵 𝟭𝟱𝟵𝟴, 𝗟𝗲𝘃𝗲𝗹 𝟭 𝗛𝗮𝗹𝗹 𝟮 📍 at MITEC and discover how we are shaping the future of semiconductor innovation. 𝗙𝗿𝗼𝗺 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝘀 𝘁𝗼 𝗣𝗿𝗼𝘁𝗼𝗻𝘀 ⚡ ASE is driving performance advantage and energy efficiency through sustainable, advanced packaging solutions powering: 𝗔𝗜| 𝗛𝗣𝗖 | 𝗗𝗮𝘁𝗮 𝗖𝗲𝗻𝘁𝗲𝗿𝘀 | 𝗥𝗼𝗯𝗼𝘁𝗶𝗰𝘀 | 𝗔𝘂𝘁𝗼𝗺𝗼𝘁𝗶𝘃𝗲 | 𝗜𝗼𝗧 | 𝟲𝗚 | 𝗔𝗲𝗿𝗼𝘀𝗽𝗮𝗰𝗲 and more. ✨ Discover career opportunities 🤝 Connect with our ASE Global ambassadors 🚀 Experience our latest innovations 🎁 Snag limited-edition ASE swag — while stocks last! Be part of the conversations shaping the semiconductor industry — and explore your future with ASE. See you there! 👋 #SEMICONSEA2026 #ASE #Innovation #AdvancedPackaging #AI #HPC #Semiconductor #LifeAtASE

@aseglobal was honored to host YAB Tuan Chow Kon Yeow, Chief Minister of Penang, at our Penang facility, joined by CEO Dr. Tien Wu, ASE Board members, @InvestPenang CEO Dato’ Loo Lee Lian, and #TECO Rep. Dr. Lien Yu-Ping. The visit reflects the strong and enduring partnership between ASE and Penang, which began in 1991 with our first overseas manufacturing facility and continues to grow. During the session, the Chief Minister reaffirmed Penang’s commitment to supporting ASE’s expansion, highlighting our growing footprint, talent development efforts, and continued investments in Malaysia as a strategic hub. He also emphasized the importance of technology transfer and capability building, particularly in advanced packaging and automation, in strengthening Penang’s semiconductor ecosystem. Dr. Tien Wu shared perspectives on the evolving semiconductor landscape, identifying robotics and humanoids as the next wave of innovation, with Malaysia well-positioned as a future manufacturing base. #TECO Rep. Dr. Lien highlighted strong Taiwan–Malaysia ties, with over 47,000 jobs created and US$3 billion invested, while @InvestPenang CEO Dato’ Loo Lee Lian underscored the state’s readiness for the next phase of global growth. Together with partners across government and industry, ASE is proud to contribute to the continued growth of Penang as a global semiconductor hub, driving innovation, talent development, and sustainable economic progress. #ASE #Penang #Semiconductors #AdvancedPackaging #AI #Robotics #Malaysia #Innovation

A prelude to #SEMICONCHINA2026, the heightened interest in advanced packaging was evident from the huge turnout at the Heterogeneous Integration / AP Conference on AI & CPO. Representing @aseglobal, Harrison Chang shared how advanced packaging + power efficiency are key to scaling AI. Innovations like 2.5D/3D ICs, FOCoS & FOCoS-Bridge deliver up to 10x performance and 70% smaller systems, while CPO enables faster, more energy-efficient optical interconnects. Jan Vardaman, an authoritative observer of technology trends, underscored a key reality: AI is no longer just a compute challenge — it is an energy challenge. With future AI systems potentially consuming up to 500MW, achieving zettascale computing will depend on system-level optimization. Isabella Drolz highlighted AI-driven X-ray & CT inspection as critical to achieving zero-defect advanced packaging. As AI continues to push performance boundaries, innovation must extend beyond compute — spanning packaging, power delivery, memory, and inspection to build a more efficient and scalable semiconductor ecosystem. #SEMICONChina #AdvancedPackaging #HeterogeneousIntegration #AI #HPC #Chiplets #CPO #powerSiP #Innovation

ASE Global was pleased to participate in the 𝙎𝙇𝙎: 𝙎𝙚𝙢𝙞𝙘𝙤𝙣𝙙𝙪𝙘𝙩𝙤𝙧 𝙇𝙚𝙖𝙙𝙚𝙧𝙨𝙝𝙞𝙥 𝙎𝙪𝙢𝙢𝙞𝙩 | 𝙈𝙖𝙡𝙖𝙮𝙨𝙞𝙖 𝙀𝙙𝙞𝙩𝙞𝙤𝙣 where industry leaders explored how the semiconductor ecosystem is addressing the growing power demands of the #AI era. Discussions highlighted the 𝘴𝘩𝘪𝘧𝘵 𝘣𝘦𝘺𝘰𝘯𝘥 𝘤𝘰𝘮𝘱𝘶𝘵𝘪𝘯𝘨 𝘱𝘦𝘳𝘧𝘰𝘳𝘮𝘢𝘯𝘤𝘦 𝘵𝘰𝘸𝘢𝘳𝘥 𝘱𝘰𝘸𝘦𝘳 𝘦𝘧𝘧𝘪𝘤𝘪𝘦𝘯𝘤𝘺, 𝘵𝘩𝘦𝘳𝘮𝘢𝘭 𝘮𝘢𝘯𝘢𝘨𝘦𝘮𝘦𝘯𝘵, 𝘢𝘯𝘥 𝘴𝘺𝘴𝘵𝘦𝘮 𝘢𝘳𝘤𝘩𝘪𝘵𝘦𝘤𝘵𝘶𝘳𝘦 𝘢𝘴 𝘈𝘐 𝘪𝘯𝘧𝘳𝘢𝘴𝘵𝘳𝘶𝘤𝘵𝘶𝘳𝘦 𝘴𝘤𝘢𝘭𝘦𝘴. Speakers also shared insights on SiC power devices, evolving AI data center power architectures, and connectivity solutions enabling high-bandwidth workloads. The summit reinforced the importance of collaboration across materials, substrates, packaging, and testing to support next-generation AI infrastructure, concluding with the SEMI SEA Members’ Networking Night that brought the community together for meaningful connections. 𝘒𝘶𝘥𝘰𝘴 𝘵𝘰 𝘓𝘪𝘯𝘥𝘢 𝘛𝘢𝘯 𝘢𝘯𝘥 𝘵𝘩𝘦 𝘸𝘩𝘰𝘭𝘦 𝘚𝘌𝘔𝘐 𝘚𝘌𝘈 𝘵𝘦𝘢𝘮 𝘧𝘰𝘳 𝘰𝘳𝘨𝘢𝘯𝘪𝘻𝘪𝘯𝘨 𝘢 𝘵𝘩𝘰𝘶𝘨𝘩𝘵𝘧𝘶𝘭 𝘢𝘯𝘥 𝘦𝘯𝘨𝘢𝘨𝘪𝘯𝘨 𝘦𝘷𝘦𝘯𝘵!

The new @ABitPersonalPod series hosted by @GlobalSemi CEO, Jodi Shelton has already featured conversations with Jensen Huang of @nvidia, @LisaSu of @AMD, Matt Murphy of @MarvellTech, and @CharlieKawwas of @Broadcom, where Jodi reaches deep into the brilliant #semiconductor industry minds driving the #AI revolution. This week, it's our CEO Tien Wu's turn. There's unexpected personal stories, thought-provoking insights, and candid philosophies. Check it out: youtube.com/watch?v=pM1jJ8WV…

From all of us at @aseglobal - wishing our partners, customers, and friends around the world a 𝙟𝙤𝙮𝙛𝙪𝙡 𝙖𝙣𝙙 𝙥𝙧𝙤𝙨𝙥𝙚𝙧𝙤𝙪𝙨 𝙇𝙪𝙣𝙖𝙧 𝙉𝙚𝙬 𝙔𝙚𝙖𝙧. 🧧 May the 𝐘𝐞𝐚𝐫 𝐨𝐟 𝐭𝐡𝐞 𝐇𝐨𝐫𝐬𝐞 bring strong momentum, breakthroughs & new opportunities. ASE is ready to 𝙥𝙤𝙬𝙚𝙧 𝙖𝙝𝙚𝙖𝙙 𝙖𝙣𝙙 𝙧𝙞𝙙𝙚 𝙩𝙝𝙚 𝙢𝙤𝙢𝙚𝙣𝙩𝙪𝙢 𝙩𝙤𝙜𝙚𝙩𝙝𝙚𝙧! 🐎 ㊗️ 大家新年快乐！ 乘赤馬，迎春禧；馬到成功，一馬當先! #ASE #YearOfTheHorse #HappyLunarNewYear

This week, the ASE Corporate Communications team was delighted to reconnect with our Korean colleagues and attend the annual #SEMICONKorea2026. 🇰🇷Korea continues to prove its status as a global semiconductor powerhouse, serving as a true barometer for the next compute cycle. The keynote sessions set a strong tone for the week. Dr. Jaihyuk Song of @Samsung shared insights on next-gen AI architectures and materials, while Dr. Tien Wu highlighted how heterogeneous integration and packaging-enabled co-design are driving more efficient, scalable systems through ecosystem collaboration 🤝. Dr. Sunghoon Lee of @SKhynix echoed the importance of sustained partnerships in creating real technology inflection points. Beyond the stage, we aligned with our Korea leadership on ASE’s vision and growth roadmap. With our presence in Paju since 1999 and the acquisition of Infineon’s Cheonan plant in 2024, our commitment to Korea has never been stronger. 💪 #K_chips #K_packaging #ASEinKorea #Paju #Cheonan #advancedpackaging

Truly excited to be here at #SEMICONKOREA! In his congratulatory speech, Vice Minister Moon Shin Hak of #MOTIE described it as Korea’s largest semiconductor gathering — where the pride of engineers meets the ambition of young talent to shape the future of our industry. Grateful to be part of the semiconductor #supercycle, with Korea clearly taking center stage. Well done to SEMI Korea | Hyun Cha | JoAnn Lee and the team for the incredible behind-the-scenes work in delivering such a great event. 👏🌟 #K_chips #K_packaging

From #GrandSlam champion to tech entrepreneur, @serenawilliams brought her discipline, perspective, and inspiration to #CES2026. In a candid conversation with @LisaEarnhardt, Serena shared how #biowearable technology from @AbbottNews helps her maintain peak physical health, mental sharpness, and business performance. Her message was clear: “When it comes to your health, knowledge is power.” #HealthTech at #CES2026 is shifting #healthcare from reactive to preventive, powered by #AI. #Longevity is no longer a buzzword; it’s becoming a lifestyle. AI is enabling non-invasive monitoring and greater access to personal health data, helping us better understand our bodies and make smarter choices every day. The future of healthcare is proactive, personalized, and data-driven, and #CES2026 has given the world a greater glimpse into how humanity can be well-served by AI. #semiconductors #advancedpackaging #VIPack #biowearables #wellness #digitalhealth #wellness

CES 2026: C’est Bon! #CES26 #CES #Robotics #Autonomous #cutest #innovation

🎶✨ As the music plays and the countdown begins, ASE warmly invites you to step into 2026 with us. Wishing you and your loved ones a year filled with 𝗴𝗼𝗼𝗱 𝗵𝗲𝗮𝗹𝘁𝗵, 𝗵𝗮𝗽𝗽𝗶𝗻𝗲𝘀𝘀, 𝗮𝗻𝗱 𝗺𝗲𝗮𝗻𝗶𝗻𝗴𝗳𝘂𝗹 𝗮𝗰𝗵𝗶𝗲𝘃𝗲𝗺𝗲𝗻𝘁𝘀! Together, let’s keep moving forward — shaping a brighter, smarter, and more inspiring year ahead. Here’s to 𝘯𝘦𝘸 𝘱𝘰𝘴𝘴𝘪𝘣𝘪𝘭𝘪𝘵𝘪𝘦𝘴, 𝘴𝘩𝘢𝘳𝘦𝘥 𝘮𝘰𝘮𝘦𝘯𝘵𝘶𝘮, 𝘢𝘯𝘥 𝘢𝘯 𝘦𝘹𝘤𝘪𝘵𝘪𝘯𝘨 𝘫𝘰𝘶𝘳𝘯𝘦𝘺 𝘪𝘯𝘵𝘰 2026. 🎉 #ASE #NewYear #2026

This Christmas season, our ASE Global teams across regions celebrated the 𝘫𝘰𝘺 𝘰𝘧 𝘤𝘰𝘯𝘯𝘦𝘤𝘵𝘪𝘰𝘯, 𝘨𝘳𝘢𝘵𝘪𝘵𝘶𝘥𝘦, 𝘢𝘯𝘥 𝘨𝘪𝘷𝘪𝘯𝘨. ✨ From 𝘧𝘦𝘴𝘵𝘪𝘷𝘦 𝘨𝘢𝘵𝘩𝘦𝘳𝘪𝘯𝘨𝘴 𝘢𝘯𝘥 𝘴𝘩𝘢𝘳𝘦𝘥 𝘮𝘦𝘢𝘭𝘴 𝘵𝘰 𝘢𝘤𝘵𝘴 𝘰𝘧 𝘨𝘪𝘷𝘪𝘯𝘨 𝘢𝘯𝘥 𝘩𝘦𝘢𝘳𝘵𝘧𝘦𝘭𝘵 𝘵𝘳𝘢𝘥𝘪𝘵𝘪𝘰𝘯𝘴, our teams across 𝙏𝙖𝙞𝙬𝙖𝙣, 𝙎𝙞𝙣𝙜𝙖𝙥𝙤𝙧𝙚, 𝙈𝙖𝙡𝙖𝙮𝙨𝙞𝙖, 𝙖𝙣𝙙 𝙩𝙝𝙚 𝙋𝙝𝙞𝙡𝙞𝙥𝙥𝙞𝙣𝙚𝙨 came together to connect, celebrate, and show appreciation for one another. These moments — filled with laughter, music, delicious food, and community spirit — remind us of what truly makes ASE special: 𝙤𝙪𝙧 𝙥𝙚𝙤𝙥𝙡𝙚, 𝙤𝙪𝙧 𝙙𝙞𝙫𝙚𝙧𝙨𝙞𝙩𝙮, 𝙖𝙣𝙙 𝙤𝙪𝙧 𝙨𝙝𝙖𝙧𝙚𝙙 𝙨𝙥𝙞𝙧𝙞𝙩 𝙤𝙛 𝙩𝙤𝙜𝙚𝙩𝙝𝙚𝙧𝙣𝙚𝙨𝙨. From all of us at ASE, wishing you a Merry Christmas and a joyful holiday season! 🎄✨ #ASE #LifeAtASE #Christmas

Singapore hosted the 4th #SEMI International Policy Summit #SIPS last week, bringing together global policymakers, industry leaders & academia to tackle the semiconductor industry’s most pressing challenges. Conversations focused on public–private collaboration, sustainability, supply chain resilience, workforce development & net-zero ambitions. ASE was delighted to support #SIPS this year. Our Vice President of Corporate Communications & Industry Partnerships, Jennifer Yuen, participated in a panel discussion on “Geopolitics and the Semiconductor Supply Chain: Strategies for Resilience and Agility.” Expertly moderated by Bettina Weiss (SEMI), the panel also featured Dave Bloss (Intel Corporation), Sahar Hafeez (Pillsbury Winthrop Shaw Pittman LLP), Lisa Jorgenson (World Intellectual Property Organization – WIPO), and Christoph Saurenbach (European Commission). Kudos to Ajit Manocha, Linda Tan & the SEMI SEA team for a highly impactful summit! 👏🌏