@eWLB_Technology

As a JCET Group Company, STATS ChipPAC -- Market Leader in Fan-out #eWLB Technology

 Singapore
statschippac.com
Joined June 2010
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15Media
Automotive Electronics: Driving The Semiconductor Market semiengineering.com/automoti… @SemicoResearch #semiconductor #automotive
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eWLB Technology retweeted
AI at the Edge@embedded_ai31 Jul 2018
New frontiers in automotive HMI and display design dlvr.it/QdMpMQ
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eWLB Technology retweeted
Ed Sperling@Chip_Insider26 Jul 2018
Debugging and testing chips is becoming more time-consuming, more complicated, and significantly more difficult at advanced nodes as well as in advanced packages semiengineering.com/debug-is… #debug #semiEDA #7nm #5nm

Debug Issues Grow At New Nodes

Debug Issues Grow At New Nodes Finding the root cause of problems becoming more difficult as systemic complexity rises; methodology and different approaches play an increasingly important role.

semiengineering.com
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Bridges Vs. Interposers semiengineering.com/using-si… #interposers #EMIB #AdvancedPackaging
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Higher Performance, Lower Power Everywhere semiengineering.com/higher-p…

Higher Performance, Lower Power Everywhere

Higher Performance, Lower Power Everywhere New compute models will require significant improvements in both speed and efficiency.

semiengineering.com
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eWLB Technology retweeted
Yole Group@YoleGroup3 Jul 2018
Components for 3D Sensing Revolution | July 10th, 2018 Get @Yole_Dev and @system_plus expertise during a free #webcast analysing the key challenges of underlying sub-components for #3Dsensing in the consumer space. Registration: goo.gl/hTx39P
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eWLB Technology retweeted
SEMI
@SEMIconex2 Jul 2018
SEMI Blog - SEMI #China Members Gather to Promote China #Semiconductor Industry Growth. bit.ly/2tz4Yc3
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Yole Group@YoleGroup22 Jun 2018
Assist the free #Webinar organized by @SEMIconex with @Yole_Dev experts on the #Automotive #market. From #radar, #LiDAR, #roboticcar, #sensor to EV/HEV electrification, #battery, #power #packaging, #compound #semiconductors and many more. Register here: goo.gl/p19bpr
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eWLB Technology retweeted
Ed Sperling@Chip_Insider18 Jun 2018
IoT Wireless Battles Ahead: Tradeoffs include power, performance, security. Each standard has its own benefits and drawbacks semiengineering.com/iot-wire… #IoT #wireless #WiFi #Zigbee #80211AH
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Progress And Chaos On Road To Autonomy--> The incredibly complicated, frequently secretive & highly competitive world of self driving technology semiengineering.com/self-dri… #selfdrivingcars #AutonomousVehicles
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#GSAEEF18 was a great event and we look forward to next year. xitter.cf/GlobalSemi/status/1004…
Johannes Deichmann, Associate Partner at @McKinsey presents findings from a joint McKinsey-GSA study on future automotive electronics architectures. #Connectivity, #Mobility, #autonomousdriving and #electrification are the main architectures that need to be developed. #GSAEEF18
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@GlobalSemi's Sandro Grigolli opening the 2018 European Executive Forum in Munich, Germany. Welcome to all attendees! #GSAEEF18
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#ECTC2018 continues with another day of advanced packaging information bit.ly/2rBlvNJ Don't miss the #IEEE seminar on High Density Packaging Technologies in the Era of Big Data @ 8pm.
Hal Lasky shares his insight with Jeff Dorsch at Semiconductor Engineering on #OSAT consolidation. xitter.cf/SemiEngineering/status…
Semiconductor Engineering@SemiEngineering14 May 2018
Big changes ahead in the OSAT industry semiengineering.com/osat-con… #OSAT @asegroup_global #China #consolidation
eWLB Technology retweeted
Ed Sperling@Chip_Insider7 May 2018
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS) semiengineering.com/mis-pack… #substrate #Molded #interconnect #packaging #cryptocurrency

MIS Packaging Takes Off

MIS Packaging Takes Off Molded interconnect substrate emerges as packaging choice for analog, power ICs and cryptocurrency chips.

semiengineering.com
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Key reasons why packaging has taken on a whole new level of interest semiengineering.com/packagin… #packaging #automotive #ISO26262 #ISO16949
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