Jan Vardaman retweeted
[PRESS] @CEA_Leti CEO @SabonnadiereE shares insights with @Jan_TechSearch about the future of R&D “𝘛𝘩𝘦 𝘙𝘰𝘰𝘵𝘴 𝘰𝘧 𝘔𝘢𝘯𝘶𝘧𝘢𝘤𝘵𝘶𝘳𝘪𝘯𝘨” in this month’s Circuits Assembly Magazine.🗞️
digital.upmediagroup.com/iss…
#RnD #RTOs #research #electronic #semiconductor
Jan Vardaman retweeted
Thanks to @Tesla for inspiring innovation across the #semiconductor ecosystem. Through #HeterogeneousIntegration, many complex functions can be integrated into one beautifully high-performance #autopilot device. We’re hearing all about it today in San Francisco at #SEMICONWest
Jan Vardaman retweeted
ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility - EFK will be ON Semi by 2022
As the next step in our transformation into the world's leading specialty foundry, we are excited to share details of a strategic partnership with @onsemi. Read more: bit.ly/2XzevwV @GFfab8 @GFfab1
Jan Vardaman retweeted
TSMC Unveils 6-nanometer Process, 18% higher logic density than N7 tsmc.com/tsmcdotcom/PRListin…
Jan Vardaman retweeted
Finally finished report on TechInsights memory talk at last year's IEDM - a great review of the technology by Jeogdong Choe
techinsights.com/blog/techin…
Jan Vardaman retweeted
Huawei Kirin 980 Mass Production Begins This Quarter, To Use TSMC’s 7nm Process gizmochina.com/2018/04/07/hu… via @gizmochina
Jan Vardaman retweeted
Shout out for #Fanout, and in particular the functionality and value it delivers for #networking and #datacenter applications. #FoCoS #NeedForSpeed
Jan Vardaman retweeted
Samsung to double flash memory output capacity in China, expanding Xian line for 3D-NAND asia.nikkei.com/Asia300/Sams…
Jan Vardaman retweeted
Leave it to industry expert Jan Vardaman of @Jan_TechSearch to help us navigate the increasing complex world of #advancedpackaging for #Crypto #bigdata #AI #5G and #SmartFactory. Thank goodness for #flipchip #SiP #sensors and all enabling technologies from #OSAT players like ASE.
Jan Vardaman retweeted
There’s no shortage of packaging & test challenges as electronics-driven lifestyles continue to rise. But there’s also no shortage of packaging & test platforms to overcome such challenges, as debated by ASE, Amkor, Techsearch and SMT, expertly moderated by Grace of @iNEMIorg.
Jan Vardaman retweeted
Jan Vardaman of @Jan_TechSearch delivered an informed perspective and shared a taste of her extensive #automotive market knowledge with the audience at @IMAPSOfficial DPC 2018 today. #lidar #Radar #Sensors #advancedpackaging #SiP #autonomousdriving #ADAS #SafetyFirst #AI
Jan Vardaman retweeted
Jan Vardaman gives the OSAT update on the #meettheexperts stage at #SEMICONWest pscp.tv/w/bDPzEDFvUEtMTXdwV1… – at San Francisco, CA












