Pinned Tweet
I excited to work with @SEMIconex team and Technical Community on our latest semiconductor challenges and solutions!
We are pleased to welcome Beth Keser as VP, Technology Coalitions.
Beth is a recognized global semiconductor leader with more than 30 years of experience in advanced packaging, chiplets, and heterogeneous integration. An IEEE Fellow and accomplished industry executive, Beth has held senior technology leadership roles at Motorola, Qualcomm, and Intel, holds more than 50 U.S. patents and patents pending, and has been widely recognized for her contributions to advancing semiconductor packaging technologies.
In this role, Beth will continue to strengthen SEMI’s ability to bring members and industry stakeholders together around the technology challenges and opportunities shaping the future of the semiconductor ecosystem. She will lead SEMI’s Technology Coalitions, Smart Initiatives, Standards, strategic collaborations and public-private R&D partnerships, building on the work already underway to accelerate collective solutions, expand industry participation, and advance SEMI’s thought leadership as the industry evolves. Beth has already jumped into her role meeting with members at recent SEMI events.
Beth remarked: “I’m excited to join SEMI at such an important time for our industry. After decades focused on advancing semiconductor technology from the back end, I’m looking forward to bringing that perspective to a broader ecosystem—connecting technology, industry leaders, and end markets to help address the challenges and opportunities ahead.”
Please join us in welcoming Beth to SEMI.
Beth Keser retweeted
SEMICON West 2026, right at your fingertips.
🔗 semiconwest.org/about/mobile…
Download the mobile app to build your agenda, explore exhibitors, navigate the show floor, and connect with attendees. Already have it? Select the 2026 event and enable notifications for show updates.
Follow @SEMIAmericas and use the official show hashtag #SEMICONWest to join the conversation.
We'll be seeing you in San Francisco!
Go through security without a boarding pass? So retro! tsa.gov/precheck/gateside-ts…
SEMI launches chip materials alliance taipeitimes.com/News/biz/arc…
“The old rule that scale-up is copper and scale-out is optical is starting to blur. As data rates climb inside the rack, copper is running into physical limits around loss, reach, and power, challenging the ability of copper within a rack." semiengineering.com/coppers-…
Beth Keser retweeted
NVIDIA Spectrum-X Ethernet Photonics is now in full production.
4x fewer lasers. 5x lower power. 10x higher mean time between incidents.
See how we built it ▶️ nvda.ws/45so1a7
Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics prn.to/4hupTq7
Beth Keser retweeted
My reaction to the SemiAnalysis institutional note that is positive on micro-LED.
Micro-VCSEL is superior in every way. MICRO-LED WILL NEVER WORK, HAS NO REASON TO EXIST, AND IS A HAOX TECHNOLOGY.
GlobalFoundries’ Growth Makes the Case for a U.S. Photonics Buildout eetimes.com/globalfoundries-…
"Interconnects now drawing attention are “closer to the chiplets, closer to the GPU, CPU, and memories.” These links are inside the rack, inside advanced packages, and across interposers. They are “starting to switch to the domain of the photons.” eetimes.com/from-co-packaged…
TSMC touts glass substrate gains as Korea players race to commercialize biz.chosun.com/en/en-it/2026…
“…the more difficult transition has always been the final one — moving optics close enough to the compute engine so that electrical signals no longer have to travel significant distances across a board before being converted into light.” semiengineering.com/making-o…













