Semiconductor Insigths by teardown and physical analysis. High Resolution dieshot using Optical Microscopy and SEM.
The Netherlands
Joined September 2024
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Chipwise retweeted
"Skips"? TSMC was first and continues to extend its hybrid bonding portfolio. AMD's X3D CPUs use TSMCs hybrid bonding and so does Apple's new M5 Pro/Max/Ultra chips. This is a super weird article.
Chipwise retweeted
Huawei's homegrown AI chip examined — Chinese fab SMIC-produced Ascend 910B is massively different from the TSMC-produced Ascend 910 trib.al/tB2RTFV
Chipwise retweeted
After 27 years of providing in-depth coverage of the amazing world of PC and mobile hardware, AnandTech is saying farewell. We want to thank everyone from the AnandTech community for their support and passion for what we’ve done over the years
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