aiMotive and Cadence Demonstrate Layer-by-Layer Workload Placement Across Independent AI Engines ow.ly/ZCsz50ZStuX

Registration is open for Rambus Design Summit 2026! Are your systems ready for Agentic AI? Explore HBM, DDR5, LPDDR5, PCIe®, Root of Trust & quantum-safe security powering next-gen AI infrastructure, AI PCs & edge. Summit date: Oct 22. Save your seat >> bit.ly/4xx2Ijl

Silicon-Proven Bluetooth® 6.3 RF IP Cores for Next-Generation Advanced Wireless SoCs - T2M ow.ly/ln8N50ZXqiX

HBM4E: Pushing the Bandwidth Envelope for Agentic AIs Join the Cadence webinar on October 22nd at 9AM PDT as we examine LLM requirements and how HBM4E memory delivers the highest available bandwidth... Register Now ow.ly/pC8S50ZXlHz

From Gate-All-Around to Complementary FETs: What’s Next in Transistor Scaling Two years ago, we introduced why the industry was moving to gate‑all‑around (GAA) transistors and how foundation IP co-optimized with... Read the Synopsys Tech Talk article>> ow.ly/ryGB50ZOxyf

Keysight Introduces PCIe® 7.0 Protocol Test Solution to Accelerate AI Infrastructure Validation Instant link-up and deep protocol visibility reduce risk and shorten next generation system development ow.ly/zxxn50ZYExB

Andes Technology Honors Quintauris as 2026 Partner of the Year Recognition highlights outstanding collaboration in accelerating automotive and safety-critical RISC-V commercialization. ow.ly/nbwR50ZQlKN

A holistic and optimized approach to embedded cybersecurity Artificial Intelligence and Post-Quantum Cryptography are reshaping the cybersecurity landscape for embedded systems... Watch the presentation from IP SoC Days Korea 26 ow.ly/uLNc50ZQnUF

Cadence-Intel UCIe Interoperability Demo at Chiplet Summit 2026 Intel Product Line Manager and co-chair of UCIe Marketing Working Group, Stephen Wong, demonstrated joint Cadence-Intel UCIe interoperability. Watch the Intel-Cadence demo... ow.ly/sZLm50ZQiqX

There's still time! Register for the Oct. 21 Live Webinar. We'll examine LLM memory requirements, show how HBM4E delivers 4 TB/s per stack, and walk through 2.5D implementation options, including silicon interposer and package design. Save your spot now>> ow.ly/fWwp50ZXMm5

At the 2026 Ceva Edge Symposium, see how breakthroughs in connectivity, sensing, and AI inference are turning edge devices into autonomous, context-aware systems, the building blocks of Physical AI and Agentic AI. Register Now ow.ly/Xtkf50ZBCUs

Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics New 100V E-mode GaN Advanced Power Transistor Family Delivers Higher Power Density and Industry-Leading Figure-of-Merit Performance ow.ly/2BxQ50ZYEtm

Synopsys and Amazon Announce Strategic, Multi-year IP Agreement for Custom Silicon; Collaboration Also Extends to Cloud and AI-Powered Engineering ow.ly/C5GX50ZThUM

Keysight Expands Active and Passive 1.6T Copper Interconnect Validation for Scale-Out Data Centers Validating digital-layer error performance is the next step for high-speed interconnects after completing optical and electrical layer compliance testing ow.ly/qiio50ZYEnK

Arteris Wins Funding to Expand Hardware Design Supply Chain Security Assurance for the Trusted and Assured Microelectronics Program Government-funded initiative advances commercially sourced third-party IP security assurance for semiconductor systems... ow.ly/rHqM50ZV4R0

Embedded Computing Design editor in chief, Ken Briodagh, interviews Frank Ferro, Group Director, IP Product Management at Cadence, for a discussion on system of Memory and Storage in the inaugural podcast episode of SystemChat. ow.ly/tAfI50ZQmgc

Securing the security – Physically Unclonable Function (PUF) With the rapid expansion of the IoT technologies which have a key role in our everyday lives, security is now becoming more and more important... Read the Secure-IC Tech Talk article>> ow.ly/uFml50ZHoBO

Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers ow.ly/eSq250ZYEkX

T2M Brings White-Box Licensing to ADC, DAC and PLL IP Cores, High-Performance, Full Modification Rights and Unlimited Usage Broad Analog IP Cores Portfolio Delivering High-Speed 4–8 GSps Data Conversion, Precision ADC/DAC and Advanced PLL IP Cores ow.ly/5SsT50ZOoLJ

S2C Named Andes Technology’s 2026 Partner of the Year Companies to demonstrate AndesCore™ AX66 RISC-V processor running Linux KVM virtualization and AI inference on S2C’s Prodigy™ S8-100 at AI Infra Summit ow.ly/qAfx50ZOUvq