From BOM to risk model, embedded system design is entering a new era where supply chain intelligence is now part of the engineering workflow. Component availability, lifecycle changes, and sourcing volatility are reshaping how teams design for resilience from day one. This article explores how traditional Bills of Materials are evolving into dynamic risk models that help engineers anticipate disruptions before they happen, reducing redesign cycles, delays, and cost overruns. With integrated intelligence platforms like WIN SOURCE NEXUS™ Solution, teams can connect sourcing, compliance, and design decisions in real time, turning uncertainty into actionable insight. Learn more: wevlv.co/4vLMhA3 #engineering #technology #billofmaterials @Win_Source