The 2022 Advancements in Thermal Management Call for Papers is now open!
thermalconference.com/call-f…
Thermal 2021 starts next week. Get signed up to network with the biggest thought leaders in the thermal and electronics industry!
thermalconference.com/
The Advancements in Thermal Management Conference is next week. Participating companies include: @Facebook @intel @Dell @Ford @Fujitsu_Global @Henkel @mentor_graphics @MSCSoftware @honeywell @Huawei @LGUS @QorvoInc NASA Jet Propulsion Lab, @ToshibaUSA
thermalconference.com/
The new @fujipoly SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of 2.1°K•cm2/W.
thermalconference.com/post/n…
Thermal Management Considerations for Today’s High-Performance COTS Backplane Systems - by Justin Moll at @pixustech thermalconference.com/confer…
Session Spotlight - High Thermal Conductivity Thermal Interface Materials Based on an Epoxy Matrix
By Kevin Roth, Project Manager, High Performance Materials -ADA Technologies, Inc.
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The 2021 Advancements in Thermal Management Conference is fast approaching. Register for this conference, being hosted virtually on Aug. 4-5.
The event will feature two full days of speakers, online expo hall, personalized 1 on 1 meetings
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Heat-Management Material from Researchers at UCLA Keeps Semiconductors Running Cool - thermalconference.com/post/h… @UCLA
Thermal Conference Session Spotlight - San Jose State University @SanJoseSt
Session Spotlight - PCM and Heat Pipes for Temperature Reduction in Electric Vehicle Batteries - Dr. Sohail Zaidi, Mechanical Engineering Department - San Jose St. University
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New Session Alert from @MSCSoftware
10x Productivity in Thermal Simulation on Battery Pack Designs -
Speaker: Yuya Ando, CFD and Multiphysics Business Manager in North America - Hexagon/MSC Software thermalconference.com/confer…
Session Spotlight - High Throughput Thermal Conductivity Measurements of
Thin Film Organic Frameworks - thermalconference.com/confer…
New session announcement - Panel Session: Thermal Management of SiC and GaN
Speakers - @PwrElectronics @EPC_Corp @UnitedSiC @ST_World
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Early Bird Pricing for the Advancements in Thermal Management Conference end June 18th.
Take advantage of early bird pricing and attend the Conference.
Registration - thermalconference.com/regist…
Program - thermalconference.com/confer…
Participating Companies - thermalconference.com/partic…
Session Spotlight for Thermal 2021 - Predicting Thermal Design Reliability with Simulation Based Surrogate Models - Speaker: John Wilson, Electronics Business Development Manager - @mentor_graphics, Digital Industries Software @Siemens
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New Low Compression Force 4.5-Watt Thermal Gap Filler
from Fujipoly - thermalconference.com/post/l…
New Session Announcement - Maximizing Thermal Interface Material Performance in High-Reliability Applications from @NanoramicLabs Day 2 - 12:30PM
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Thermal Conference 2021 - Program Announced
Join companies such as @Fujitsu_Global , @mentor_graphics, University of Maryland, Hymet Thermal, Vanguard Products Corporation, @VirginiaTech_ME and many more in this jam packed program.
thermalconference.com/confer…
Electric Vehicles to Drive Demand for Thermal Interface Materials Says Advancements in Thermal Management Keynote @IDTechEx - thermalconference.com/post/e…
Element Solutions, Inc. Acquires of H.K. Wentworth Group - thermalconference.com/post/e…
@elementsolns
New Session Announcement - Co-Design of Thermal and Electromagnetics for Development of Light & High Efficiency Electric Powertrains
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