We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. Tweets by TIers.
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Joined April 2009
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We recently introduced a new 450V intelligent power module that includes a GaN three-phase bridge for motors up to 250W, which is only 12x12mm. Find out more about it in this @ElectronicsNews article here: bit.ly/45yAuZ1
Explore how TI’s technology and systems for electric two and three wheeler applications can help you enable safer operation and get to market faster.
Learn about our traction-inverter reference design here: bit.ly/3LvPGNo
Our new, industry-first integrated GaN intelligent power module (IPM) for 250W motors helps engineers design smaller, more energy efficient HVAC and home appliances. Read more: bit.ly/3KFo1sS
At TI, we are committed to providing scalable solutions that meet diverse customer needs. Check out our extensive range of microcontrollers, microprocessors, and connectivity devices designed to empower developers which we showcased to @electropages bit.ly/4chHDPG
Want to optimize your new space applications by learning about the latest packaging types and corresponding qualification classes?
Join our on-demand webinar to learn how to choose the quality class that best fits your mission profile. Register here: bit.ly/3HWuU7O
We had a great time at #PCIM last week. Our experts presented demos on how we are transitioning to a more sustainable future with reliable high-voltage technology. See you next year! ti.com/pcim
We had a wonderful time at this year’s Automobil Elektronik Kongress! Our TI experts presented a demo on our Driver and AI based in-cabin monitoring. Thanks to everyone who stopped by the booth, see you next year!
Don’t miss our webinar at 12pm CET on Thursday, 4th July to learn about our unique approach to GaN power modules, integrating the GaN FET, gate driver, and protection circuitry.
Register here. bit.ly/3Vr3MV0
We’re at Automobil Elektronik Kongress in Ludwigsburg today and tomorrow!
If you’re attending the event stop by and see us at Booth 19, where we will have a demo on our driver and AI based in-cabin monitoring.
#AutomobilElektronikKongress
The final day of #PCIM has arrived! If you haven't visited our booth already, come find us in Hall 7 Booth 652. Discover more here: bit.ly/4dQp5HE
We are attending #PCIM this week! Come and say hello to us in Hall 7 Booth 652. We will have exciting demos at the show. Find out more here: bit.ly/4dQp5HE
Our Product Line Manager of High Performance Processors, Mike, recently spoke to @Digikey about building smarter, safer robotics and automotive applications. Find out more here: bit.ly/3xwe2Tq
At #embeddedworld last month, we showcased our hybrid microinverter and the HVAC system which is aimed at enhancing efficiency and promoting green energy practices. Learn more about how they work in this article from @ElectromakerIO: bit.ly/49CART0
In today’s world, nearly every moment in our life is powered by an electronic system, from our cars to phones and in our homes. Discover why manufacturing in 45nm to 130nm process nodes enables us to achieve optimal performance for these essential chips: bit.ly/3VHd0Oz
Anne Cedzich our ESH (Environmental, Safety and Health) Manager at TI in Freising, has been selected as one of the winners of the “Manager of the Year 2024” award from @MarktTechTweets in the sustainability category. We want to congratulate Anne on her success!
Our new portfolios of GaN and isolated DC/DC power modules can achieve industry-leading power density with innovative package technology. Find out more about them here: bit.ly/49DxEms
Explore our continued progress in our efforts toward environmental sustainability, workplace inclusivity and supporting our local communities in our 2023 Corporate Citizenship Report. Learn about our progress and goals in the report here: bit.ly/3JOOcgv
Our Systems Engineer, Michael joined the @satsearchco Space Industry podcast to discuss packaging innovation for space applications. We discussed how and why TI will continue to offer QMLV-RHA (ceramic) packaging. Listen here!
In episode 62 of the Space Industry podcast, we discuss the packaging of electronic components for space with Adrian Helwig and Michael Seidl from @TXInstruments.
Listen to the full episode on @satsearchco blog: blog.satsearch.com/2024-04-1…
ALT In episode 62 of the Space Industry podcast, we discuss the packaging of electronic components for space with Adrian Helwig and Michael Seidl from Texas Instruments. Following are the key points covered in the podcast: > The benefits of using plastic packages vs. ceramic packaging > These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes > The role that Texas Instruments (TI) has played in supporting the standardization of QMLP > How and why TI will continue to offer QMLV-RHA (ceramic) packaging > How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities Listen to the full episode on satsearch blog: https://blog.satsearch.com/2024-04-18-packaging-innovation-for-space-applications-with-texas-instruments
The electrification of vehicle systems is growing in advanced driver assistance systems (ADAS). Meeting these advanced needs requires a multicore processor such as the TDA4VH-Q1, which can support electronic control units (ECUs) beyond 100A. Learn more: bit.ly/3IEDj08
Manufacturers are evolving their vehicle architectures to aggregate active safety functions in ADAS domain controllers. Cameras and driver-monitoring systems can help achieve five-star safety ratings and meet regulatory deadlines. Learn about the process bit.ly/43m1MAE