Hot Interconnects 2024 is right around the corner! We're honored and excited to be a part of the insightful panel with distinguished peers on the future of AI interconnects.
Our Founder & CEO Dr. Bardia Pezeshki will be there. Don't miss it!
Register 👉 hoti.org/registration/
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Avicena — Transforming connectivity with ultra-fast µLEDs
Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach
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"We have already demonstrated the benefits of LightBundle links in data center, HPC, and ML/AI with bleeding edge power and density requirements." #innovation #semiconductor businesswire.com/news/home/2…
Avicena’s LightBundle technology provides an opportunity for GaN microLEDs to impact numerous key applications including HPC, AI/ML, sensors, automotive and aerospace #innovation #semiconductor businesswire.com/news/home/2…
Avicena Acquires microLED Fab Facility and Engineering Team From Nanosys
#innovation #semiconductor businesswire.com/news/home/2…
Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022 #semiconductor #innovation businesswire.com/news/home/2…
Avicena Raises $25 Million in Series A to Fund Development of High Capacity microLED-based Optical Interconnects #optical #connectivity
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Avicena partners with @lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density. businesswire.com/news/home/2…
#semiconductor #innovation
Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021 businesswire.com/news/home/2…
Reinventing Chip-to-Chip interconnects; Avicena’s LightBundle™ interconnects achieve 10x – 100x power and density improvements over any alternative for 1 cm – 10 meter reach. businesswire.com/news/home/2…






