Heading to @electronicaFair? Come see us at Booth B2.128, November 10-13 in Munich. Bring your footprint, pitch, or space constraint, and our engineers will help you find the right fit.

Stamped terminals trade contact area and cycle life for lower cost, until it fails in the field. AIC's screw-machined terminals give a uniform contact surface and cut solder wicking during reflow. Not flashy, but it prevents field failures. bit.ly/4hE4JpG

Manually pulling BGA footprint data from datasheets is tedious and error-prone — easy to transpose a dimension or miss a pitch variant. AIC's BGA Footprint Finder lets you search by package, pitch, and ball count for verified footprint data in seconds.bit.ly/4gfhK6u

Fine pitch B2B connectors: tighter pitch = more density, but can cost reliability under vibration/thermal cycling. AIC's line spans 0.50mm–1.0mm pitch (Mezza-pede SMT + newer B2B SMT series) so you can balance density vs. reliability. Full lineup: bit.ly/4x4fHJM

Standard solutions don't always solve complex design challenges. AIC's custom board-to-board connectors are engineered to your specs — from rugged board stacking to micro flex cable-to-board. Work with your local Rep or Distributor to get started. advanced.com/products/board-…?

Single, dual, or triple row strips. 2–100 positions. Pitches of 1.27, 2.00, or 2.54mm. Closed-end terminals prevent solder wicking. Gold/Gold or Matte Tin/Gold plating for lead-free compatibility. Built to adapt. bit.ly/3JfoOTY

Our BGA Footprint Finder Tool takes the guesswork out of socket selection — enter your device details, match your AIC BGA Footprint Number, & build your part number in just a few steps. No match found? Submit your specs! Try it today: bit.ly/4eyTtce?

This Fourth of July, we're celebrating more than a holiday we're celebrating the freedom to build, innovate & solve problems that matter. To our team, partners, & customers: thank you for the trust that makes this work possible. Wishing everyone a meaningful Independence Day. 🇺🇸

SOIC to DIP Adapters from Advanced Interconnections provide a simple, reliable way to convert .050" (1.27mm) pitch SOIC devices into a dual in-line (DIP/DIL) format—ideal for prototyping, testing, or extending the life of existing designs. bit.ly/4cYvnHa

Already know the Advanced (AIC) part number you're searching for? Enter it on our site for product info. Search tips: Enter a few characters for a list of similar part numbers or exact part number to narrow your results. Get started here: bit.ly/3Pof0KO