We've developed a two-phase, direct-to-chip liquid cooling solution that delivers 4500W per socket and up to 50% energy savings for the AI and HPC era.
Austin, Texas
Joined August 2025
- Tweets369
- Following31
- Followers908
- Likes5
Today, Accelsius has announced it will provide the NeuCool® IR150, the industry's first fully-integrated rack plus CDU, to Villanova University, a founding member of the Energy-Smart Electronic Systems (ES2) federal research program.
READ THE FULL ANNOUNCEMENT: na2.hubs.ly/H08N8zk0
With support from fellow industry partners including Google, Microsoft, and Meta, ES2 aims to improve the energy efficiency of U.S. data centers by 20-35% — by its own estimate, the equivalent of removing one to two power plants every three years. The ES2 laboratory also performs extensive research for OMNICOOL, the NVIDIA-led research project under ARPA-E's COOLERCHIPS program.
Our participation in ES2 continues our ongoing support in data center energy efficiency research. Villanova is one of three university sites participating in ES2, alongside The University of Texas at Arlington, where Accelsius participates in a COOLERCHIPS project led by Dr. Dereje Agonafer.
We hope you get a chance to see our NeuCool IR150 in action at Villanova. If interested, please feel free to contact Dr. Alfonso Ortega, James R. Birle Professor of Energy Technology and ES2 Site Director.
See you at SC26? We'll be joining Legrand in Booth 2556 to showcase the NeuCool® IR150, the industry's first fully integrated rack plus CDU, and discuss why two-phase direct-to-chip is the inevitable next step for mission critical cooling. We hope to see you there!
NEW RESEARCH: Presented at InterPACK 2026, our latest research highlights key takeaways when optimizing microchannel cold plates for two-phase boiling — paving the path for highly efficient two-phase cooling solutions in next-gen high-performance data centers.
Be sure to click the link in the replies to download the full findings from our expert team of thermal engineers.
TODAY: Attending InterPACK 2026? If so, be sure to attend CTO Dr. Richard Bonner's panel on ways to overcome common engineering challenges with at-scale liquid cooling deployments, including two-phase direct-to-chip. We hope to see you there!
EXECUTIVE INTERVIEW: For NYSE's F1 Capital Factory '26, CEO John Hewitt and Executive Chairman Josh Claman met with theCUBE's John Furrier to discuss why two-phase direct-to-chip addresses the power and heat constraints limiting AI factory scaling.
WATCH: na2.hubs.ly/H08FjfN0
NEW PANEL: At InterPACK 2026, Dr. Qingyang Wang will deliver key insights in a special session dedicated to paving the way for next-gen AI data center infrastructure. Attend to discover how two-phase direct-to-chip plays a key role in optimizing our industry's future.
TOMORROW: Are you in San Diego for InterPACK 2026? If so, be sure to attend Dr. Qingyang Wang's latest research on two-phase in microchannel cold plates, designed to support the development of efficient cooling solutions for next-gen high-performance data centers.
NEXT WEEK: Will we see you in San Diego for InterPACK 2026? If so, be sure to attend Dr. Qingyang Wang's latest research on two-phase in microchannel cold plates, designed to support the development of efficient cooling solutions for next-gen high-performance data centers.
IN CASE YOU MISSED IT: We've crunched the numbers: in a head-to-head competition, two-phase direct-to-chip offers a clear competitive advantage in the metrics that matter most for mission critical data centers.
Download the full infographic to learn more: na2.hubs.ly/H08h5Cv0
